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| Switched Memory Architectures |
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Implemented directly in the silicon architecture, this integrated circuit technology benefits advanced (including optical) computing. More Information... |
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| Population-Based Phamacokinetic in silico Analysis to Estimate Drug Variability and Response in Human and Animal Populations |
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Physiologically-based pharmacokinetic (PBPK) modeling methodologies are the most scientifically sound and rigorous approaches for simulating the absorption, distribution, metabolism, and elimination of xenobiotics. The utility for this technology is predicting whether a drug should be dosed based on body weight, surface area, a fixed dose, or whether caution should be taken with specific populations with known issues or deficiencies in an identified critical route of elimination or other pathologies. This would optimize dosing schema for a given agent within and between populations. In addition, this method would predict variability and traits in a given population that make individuals more susceptible to adverse drug events or therapeutic failure. More Information... |
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| Tissue Archival Database |
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A database to enable tracking of tissue samples. Database information includes patient information, diagnosis, histology, freeze/thaw cycles and sample location. Labels are generated from the database for sample tubes. More Information... |
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| ASEF Correlation Filters for Signal Processing and Object Detection and Recognition |
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ASEF Correlation Filters for Signal Processing and Object Detection and Recognition More Information... |
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| Fast Detection of Defective Nanopillars in Large Arrays for Microprocessor Fabrication |
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A rapid, high-throughput method for the enhanced detection of defects in individual nanopillars comprising a large array. Computer chip companies are investigating such arrays as a possible next-generation chip architecture but lack the analytical capabilities that this invention provides. More Information... |
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| Serial Vertical Interconnects for 3D Integrated Circuits |
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As integrated circuit (IC) elements reach the limit of miniaturization, IC designs are shifting from 2D to 3D. This invention is a vertical interconnect between layers of an IC.
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